Type

CPU / Microprocessor

Market segment

Desktop

Family

Model number ? 

CPU part numbers

• CM8070804497016is an OEM/tray microprocessor

• BX8070811400Fis a boxed processor (English version)

• BXC8070811400Fis a boxed processor (Chinese version)

Frequency ? 

2600 MHz

Maximum turbo frequency

4400 MHz (1 core)
4200 MHz (all cores)

Low power frequency

800 MHz

Bus speed ? 

8 GT/s DMI

Clock multiplier ? 

26

Package

1200-land Flip-Chip Land Grid Array

Socket

Socket 1200

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

March 16, 2021

Price at introduction

$157

Microarchitecture

Rocket Lake

Processor core ? 

Rocket Lake-S

Manufacturing process

0.014 micron

Data width

64 bit

The number of CPU cores

6

The number of threads

12

Floating Point Unit

Integrated

Level 1 cache size ? 

6 x 32 KB 8-way set associative instruction caches
6 x 48 KB 12-way set associative data caches

Level 2 cache size ? 

6 x 512 KB 8-way set associative caches

Level 3 cache size

12 MB 16-way set associative inclusive shared cache

Physical memory

128 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• AVX2 / Advanced Vector Extensions 2.0

• AVX-512 / Advanced Vector Extensions 512

• BMI / BMI1 + BMI2 / Bit Manipulation instructions

• Deep Learning Boost

• F16C / 16-bit Floating-Point conversion instructions

• FMA3 / 3-operand Fused Multiply-Add instructions

• Gaussian Neural Accelerator 2.0

• SHA / Secure Hash Algorithm extensions

• EM64T / Extended Memory 64 technology / Intel 64 ? 

• HT / Hyper-Threading technology ? 

• VT-x / Virtualization technology ? 

• VT-d / Virtualization for directed I/O

• TBT 2.0 / Turbo Boost technology 2.0 ? 

Security Features

• NX / XD / Execute disable bit ? 

• MPX / Memory Protection Extensions

• SMAP / Supervisor Mode Access Prevention

• SMEP / Secure Mode Execution Protection

• UMIP / User Mode Instruction Prevention

Low power features

• Core C1/C1E, C3, C6, C7, C8, C9 and C10 states

• Package C3, C6, C7, C8, C9 and C10 states

• Display Power Saving Technology

• Enhanced SpeedStep technology ? 

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels (per controller): 2
Memory channels (total): 2
Channel width (bits): 64
Supported memory: DDR4-2933, DDR4-3200
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 51.2

Other peripherals

• Direct Media Interface 3.0 (8 lanes)

• PCI Express 4.0 interface (16 lanes for discrete graphics, 4 lanes for storage)

Minimum/Maximum operating temperature ? 

0°C (case) – 71.3°C (case)
100°C (junction)

Thermal Design Power ? 

65 Watt